All Alternatives

Alternatives to Analog Devices DS26334GA3+

Analog Devices DS26334GA3+ and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Analog Devices DS26334GA3+

DS26334GA3+ compared against its qualified second sources
DS26334GA3+Analog DevicesDS26334GN+Analog Devices / Maxim IntegratedDS26324G+Analog Devices / Maxim Integrated
FFF CompatibilityDirect drop-in replacement utilizing the exact same 256-ball TE-CSBGA footprint and pin assignments.Identical physical package dimensions (17mm x 17mm CSBGA-256) and mounting style.Matches all performance specs and extends the operating temperature range from commercial to industrial.Shares the same physical footprint, but has internal electrical differences (such as current consumption profiles) and is not designated as a universal drop-in replacement.Matches the physical package dimensions and SMD mounting style.Supports short-haul T1/E1/J1 applications only, lacking the long-haul capability of the original DS26334.
AI Summary

DS26334GA3+ by Analog Devices: Telecom Interface ICs 3.3V E1/T1/J1 16Ch Short/Long Haul LIU.

The DS26334GN+ is the industrial-temperature version of the same series. It represents a direct pin-to-pin, electrical, and physical drop-in replacement, with the only difference being the wider operating temperature range. Note that this sibling part is also discontinued by the manufacturer.

  • Direct drop-in replacement with identical pinout and footprint.
  • Identical electrical characteristics and short/long-haul support.
  • Extended industrial temperature range of -40°C to +85°C (compared to 0°C to +70°C for the commercial version).
  • Shares the same legacy platform and is also discontinued/obsolete, which may present sourcing challenges.

The DS26324G+ is the short-haul-only sibling within the same Maxim/ADI family. While it is housed in the same 256-ball TE-CSBGA package, it is limited to short-haul configurations and is also obsolete.

  • Shares the same 256-ball TE-CSBGA package footprint.
  • Very similar register and software architecture, reducing firmware migration efforts.
  • Short-haul support only; does not support long-haul applications.
  • Discontinued and obsolete status.
Lifecycle StatusObsoleteObsoleteObsolete
Market AvailabilityDiscontinuedDiscontinuedDiscontinued
REACHUnknownUnknownUnknown
RoHSRoHSRoHSRoHS
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