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Alternatives to Analog Devices LT3012EDE

Analog Devices LT3012EDE and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Analog Devices LT3012EDE

LT3012EDE compared against its qualified second sources
LT3012EDEAnalog DevicesLT3013EDE#PBFAnalog Devices Inc.LT3012EFE#PBFAnalog Devices Inc.
FFF CompatibilityPinout differs slightly because pins 6 and 7 are used for PWRGD and CT functions (previously NC). Can drop-in if these pads are left electrically isolated on the PCB.Uses the same DFN-12 physical package with identical thermal pad and external dimensions.Maintains the exact same 250mA output capability, 80V input voltage ceiling, and micropower characteristics.Housed in a 16-lead TSSOP package which has a completely different pin layout and footprint from the 12-pin DFN.TSSOP package is physical larger and utilizes gull-wing pins instead of a leadless DFN package.Features the exact same electrical performance, adjustable feedback, and -40C to 125C operating temperature range.
AI Summary

LT3012EDE by Analog Devices: LDO Voltage Regulators LT3012 - 250mA, 4V to 80V Low Dropout Micropower Linear Regulator.

A close sibling regulator that introduces Power Good functionality. It has the same footprint and can serve as a drop-in replacement if pins 6 and 7 were left floating on the original board layout.

  • Same 250mA output current and 4V to 80V input voltage range
  • Adds Power Good (PWRGD) and timing delay (CT) features
  • Same 12-pin DFN package dimensions (4mm x 3mm)
  • Slightly higher operating quiescent current (65uA vs 40uA)
  • Pinout assignments differ on pins 6 and 7 (PWRGD and CT instead of NC)

This is the TSSOP-16 package variant of the LT3012 series. It is a highly stable option if a board layout redesign is acceptable to move away from the DFN package.

  • Same electrical core with 80V input capability and 250mA limit
  • Better thermal handling and heat dissipation in TSSOP package
  • Requires a complete PCB footprint and layout redesign
  • Larger board space footprint compared to the compact DFN-12 package
Lifecycle StatusObsoleteActiveActive
Market AvailabilityDiscontinuedIn stockIn stock
REACHUnknownREACHREACH
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