All Alternatives

Alternatives to Infineon Technologies CY7C68013A-128AXI

Infineon Technologies CY7C68013A-128AXI and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Infineon Technologies CY7C68013A-128AXI

CY7C68013A-128AXI compared against its qualified second sources
CY7C68013A-128AXIInfineon TechnologiesCYUSB2316-BF104AXIInfineon TechnologiesCYUSB2318-BF104AXIInfineon Technologies+1more
FFF CompatibilityTransitions from a 128-pin TQFP to a 104-ball BGA package, losing the physical 16-bit 8051 external address/data bus routing.Housed in a 104-ball BGA package, which differs completely in footprint and mounting style from the original 128-pin TQFP.Fully covers the High-Speed USB 2.0 and parallel FIFO functionality of the FX2LP with superior general computing specs.The CYUSB2318 uses a 104-ball BGA package (0.50 mm pitch) and does not expose the legacy physical 8051 external address/data bus pins present on the 128-pin TQFP package, necessitating a complete PCB layout redesign.The footprint transitions from a leaded 128-pin Thin Quad Flat Pack (14x20 mm TQFP) to a leadless 104-ball Ball Grid Array (BGA) surface-mount package.Fully meets and exceeds all USB 2.0 High-Speed performance requirements of the legacy FX2LP, offering significantly superior processing power, larger RAM, and contemporary peripherals with backwards-compatible interface modes.
AI Summary

CY7C68013A-128AXI by Infineon Technologies: 8051 EZ-USB FX2LP™ USB Microcontroller Microcontroller IC ROMless 128-LQFP.

This is a cost-optimized alternative within the next-generation active EZ-USB FX2G3 family. It provides the same fundamental USB-to-parallel FIFO bridging as the CYUSB2318 with dual-core ARM processing, but lacks some high-end hardware options. A board redesign is necessary to accommodate the 104-ball BGA footprint.

  • Official next-generation replacement belonging to the active EZ-USB FX2G3 family
  • Significant CPU performance upgrade utilizing dual ARM Cortex cores instead of 8051
  • Significantly larger RAM space (1024 KB) allowing much larger buffering arrays
  • Requires replacing legacy 8051 assembly or C code with an ARM-compatible firmware application
  • Requires transitioning the PCB layout from a leaded TQFP to a ball grid array (BGA) package

This is Infineon's official high-end next-generation active replacement for the obsolete EZ-USB FX2LP series. It transitions the legacy 8051 core to a dual-core ARM Cortex-M4F/M0 architecture and provides 1024 KB SRAM while retaining the 16-bit parallel FIFO interface. Due to the package change from 128-pin TQFP to a 104-ball BGA, a full board redesign is required.

  • Official next-generation active family upgrade line from Infineon (EZ-USB FX2G3)
  • Drastically upgraded processor: Dual-core ARM Cortex-M4F + Cortex-M0 instead of the legacy 8051
  • Vastly increased internal RAM size: 1024 KB SRAM instead of only 16 KB
  • Completely different software stack and toolchain required to program the ARM cores vs the legacy 8051 code
  • Requires a complete redesign of the board layout to route the BGA balls
Lifecycle StatusObsoleteActiveActive
Market AvailabilityNon-stockNon-stockNon-stock
REACHREACHUnknownUnknown
RoHSRoHSUnknownUnknown
——— ————————— ——— ———————— ———————— ————— ———
—————— ————————— ————————— ——— ———————— ——————
———— ————— ————— —————————— ————————— ——— ————
—— ————————— ———————— ————— —————————— ————
——— ————————— ——— ———————— ———————— ————— ———
—————— ————————— ————————— ——— ———————— ——————
———— ————— ————— —————————— ————————— ——— ————
—— ————————— ———————— ————— —————————— ————

Unlock all 3 alternatives

Sign in with your work email to read every gated row on this table — description, lead time, origin, export control and the full technical data.

Sign in to unlock

Signing in creates a free Parter account. We use your name and email to contact you about Parter — see our Privacy Policy.

  • Find & compare verified second sources
  • Spot risk early with real-time part monitoring
  • Stay compliant and production-ready

Related parts

PartMarket availabilityLifecycleAlternatives available
CY7C68013A-128AXCInfineon TechnologiesDiscontinuedObsolete4Alternatives availableSee Alternatives
CY7C1354C-166AXIInfineon TechnologiesIn stockObsolete3Alternatives availableSee Alternatives
CY7C1041CV33-10BAXAInfineon TechnologiesNon-stockObsolete4Alternatives availableSee Alternatives
CY7C1339G-133AXCTInfineon TechnologiesDiscontinuedObsolete4Alternatives availableSee Alternatives
CY7C1049D-10VXITInfineon TechnologiesDiscontinuedObsolete4Alternatives availableSee Alternatives
SCC2698BC1A84,512NXPDiscontinuedObsolete2Alternatives availableSee Alternatives

You searched one part. Parter watches your whole BOM.

  1. All your BOM, at once

    Parter maps every line to live stock, lead time, lifecycle and compliance data across the entire market — not part by part.

  2. Hear about problems before they hit production

    Allocation, EOL and last-time-buy notices surface the moment they appear, not when your buyer's PO bounces.

  3. Qualified replacements in minutes, not days

    Every at-risk line gets form-fit-function matches like the ones above — deltas flagged, evidence attached. Review, push to your BOM, and Parter starts watching the new part too.

Schedule a demo

See Parter in action

Discover how Parter can help your hardware team:

  • Streamline your hardware operations with AI
  • Detect and prevent lifecycle disruptions
  • Accelerate product development
  • Stay compliant and production-ready