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Alternatives to Microchip Technology MIC38300HYHL-TR

Microchip Technology MIC38300HYHL-TR and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Microchip Technology MIC38300HYHL-TR

MIC38300HYHL-TR compared against its qualified second sources
MIC38300HYHL-TRMicrochip TechnologyMIC38300AHYHL-TRMicrochip Technology
FFF CompatibilityHas the same 28-pin land pattern, but has separate fused center exposed pads that have different electrical potentials and must not be tied directly to ground, unlike the original part's ePAD.Thicker package height of 1.55 mm compared to the original 0.9 mm.Directly matches all key electrical parameters and performance ratings, including 3A peak/2.2A continuous current.
AI Summary

MIC38300HYHL-TR by Microchip Technology: Non-Isolated PoL Module DC DC Converter 1 Output 1 ~ 5V 3A 3V - 5.5V Input.

This is the official active direct successor from Microchip, designed specifically to replace the obsolete MIC38300 series. It features the same HELDO architecture and equivalent electrical parameters, though it has a thicker package and updated center-pad requirements.

  • Official direct successor from the same manufacturer
  • Maintains identical electrical ratings (3.0V-5.5V input, 3A peak / 2.2A continuous output)
  • Identical 28-pin 4mm x 6mm land pattern footprint
  • Thicker package (1.55 mm vs 0.9 mm) may affect tight vertical clearance designs.
  • Center pads must not be tied directly to ground (different electrical potentials), requiring careful review of the PCB solder mask and layout.
Lifecycle StatusObsoleteActive
Market AvailabilityDiscontinuedNon-stock
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