Alternatives to Microchip Technology SST39VF020-70-4C-WHE
Microchip Technology SST39VF020-70-4C-WHE and its qualified second sources, compared on form/fit/function, stock, lifecycle and price — the same checks Parter runs inside a BOM.
 SST39VF020-70-4C-WHEMicrochip Technology | SST39VF020-70-4C-TUMicrochip Technology | SST39VF020-70-4I-TUMicrochip Technology | +2more | |
|---|---|---|---|---|
| FFF Compatibility | The logical pin assignments are completely identical; however, the package width is slightly narrower (11.8 mm tip-to-tip span vs 12.4 mm), requiring verification of the existing PCB land pattern.Both are thin TSOP-32 packages, but the TU package outline has a slightly shorter physical length/lead span compared to the obsolete WHE package.Identical electrical specifications, 2Mbit size (256K x 8), and voltage operating range (2.7V to 3.6V). | Logical pinout is identical to the original part, but the physical lead span is narrower (11.8 mm vs 12.4 mm), meaning it is not a direct physical drop-in without verifying pad dimensions.Utilizes the migrated TU package style, which is slightly narrower than the original WHE package.Direct electrical equivalent but with an expanded thermal operating envelope. | ||
 AI Summary | SST39VF020-70-4C-WHE by Microchip Technology: FLASH Memory IC 2Mbit Parallel 70 ns 32-TSOP. | This is the official drop-in migration part recommended by Microchip to replace the obsolete WHE package suffix with the active TU package suffix. It has identical logic, timing, and pin assignments, but uses a slightly narrower TSOP-32 package profile.
| This industrial-grade version of the TU-migrated part is fully functional-compatible and offers an expanded operating temperature range. It is highly suitable for designs needing robust environmental tolerance while maintaining the same logical architecture.
| |
| Lifecycle Status | Obsolete | Unknown | Unknown | |
| Market Availability | In stock | Unknown | Unknown | |
| REACH | REACH | Unknown | Unknown | |
| RoHS | RoHS | Unknown | Unknown | |
| Description | FLASH Memory IC 2Mbit Parallel 70 ns 32-TSOP | This is the official drop-in migration part recommended by Microchip to replace the obsolete WHE package suffix with the active TU package s | This industrial-grade version of the TU-migrated part is fully functional-compatible and offers an expanded operating temperature range. It | |
| Manufacturer | Microchip Technology | Microchip Technology | Microchip Technology | |
| Type | Memory | Component | Component | |
| Datasheet | Open | N/A | N/A | |
| Lead Time | 4 weeks | Unknown | Unknown | |
| Country of Origin | JP | - | - | |
| Export Control Class Number | EAR99 | EAR99 | EAR99 | |
| HTSUS Code | 8542.32.0071 | - | - | |
| Moisture Sensitivity Level | 3 (168 Hours) | - | - | |
| Technology | FLASH | - | - | |
| Access Time | 70 ns | - | - | |
| Memory Size | 2Mbit | - | - | |
| Memory Type | Non-Volatile | - | - | |
| Memory Format | FLASH | - | - | |
| Mounting Type | Surface Mount | - | - | |
| Package / Case | 32-TFSOP (0.488", 12.40mm Width) | - | - | |
| Memory Interface | Parallel | - | - |
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Frequently asked questions
Yes. The Microchip Technology SST39VF020-70-4C-WHE is marked obsolete, so the manufacturer has discontinued it and any remaining supply is limited to distributor stock. The qualified second sources on this page are active parts you can design in today.
The closest qualified second sources for the Microchip Technology SST39VF020-70-4C-WHE are the SST39VF020-70-4C-TU (Microchip Technology) and the SST39VF020-70-4I-TU (Microchip Technology), out of 4 matched alternatives in total. Each is compared against the original on fit, form and function in the table above.
Not always. The alternatives to the SST39VF020-70-4C-WHE are matched on function but can differ in package, pinout or a key parameter, so review the fit/form/function notes in the table and the datasheet before designing one in.
The SST39VF020-70-4C-WHE (Microchip Technology) is a part in the Memory category. This page lists qualified, cross-referenced replacements for it with a side-by-side comparison.
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