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Alternatives to Micron Technology Inc. MT40A1G16KD-062E IT:E

Micron Technology Inc. MT40A1G16KD-062E IT:E and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Micron Technology Inc. MT40A1G16KD-062E IT:E

MT40A1G16KD-062E IT:E compared against its qualified second sources
MT40A1G16KD-062E IT:EMicron Technology Inc.MT40A1G16TD-062E:FAlliance Memory, Inc.
FFF CompatibilityThe JEDEC standard 96-ball FBGA footprint is electrically identical, but the physical package is narrower (7.5 mm x 13.0 mm) compared to the original obsolete package (9.0 mm x 13.0 mm).The package width is reduced from 9.0 mm to 7.5 mm, which might require verification of pick-and-place nozzle setup and mechanical clearances.Operating temperature is rated for Commercial range (0°C to 95°C) whereas the original was Industrial grade (-40°C to 95°C).
AI Summary

MT40A1G16KD-062E IT:E by Micron Technology Inc.: SDRAM - DDR4 Memory IC 16Gbit Parallel 1.6 GHz 19 ns 96-FBGA (9x13).

This active part from Alliance Memory uses the licensed Micron DDR4 Revision F die. It is electrically identical and JEDEC pin-compatible, but comes in a physically narrower 7.5mm x 13mm package and is rated for commercial temperatures only.

  • Same original Micron die architecture (Revision F) and JEDEC standard 96-ball footprint
  • Retains identical electrical ball layout and interface definitions
  • Active lifecycle status under Alliance Memory reselling/licensing program
  • Lower operating temperature ceiling: 0°C to 95°C vs. Industrial -40°C to 95°C
  • Narrower package size requires layout verification if tight mechanical tolerances are present
Lifecycle StatusObsoleteActive
Market AvailabilityNon-stockIn stock
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