All Alternatives

Alternatives to National Semiconductor LM195K/883

National Semiconductor LM195K/883 and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for National Semiconductor LM195K/883

LM195K/883 compared against its qualified second sources
LM195K/883National Semiconductor5962-8777801YANational SemiconductorLM195H/883Texas Instruments+1more
FFF CompatibilityBoth parts share the exact same TO-3 metal can footprint and pinouts (Pin 1: Base, Pin 2: Collector, Case: Emitter).The physical package is a standard TO-3 metal can (TO-204AA) with identical mechanical dimensions.Electrically identical with the same military high-reliability screening and qualification.The TO-5 (TO-39) package footprint is incompatible with the larger TO-3 footprint.Significantly smaller physical form factor (TO-5 metal can vs TO-3 power package).Electrically identical silicon with the same voltage, current, and temperature specifications.
AI Summary

LM195K/883 by National Semiconductor: Bipolar (BJT) Transistor NPN - Darlington 42 V Through Hole TO-3-2.

This is the official Standard Microcircuit Drawing (SMD) military-qualified cross-reference for the LM195K/883. It is a direct drop-in replacement with identical specifications, package, and reliability screening.

  • Direct military-grade equivalent qualified to standard SMD (Standard Microcircuit Drawing) standards
  • Identical electrical specifications including 42V breakdown and 1.0A load current limit
  • Identical TO-3 metal can package footprint and pinout assignment

This is a same-family sibling screened to military standards but packaged in a smaller TO-5 metal can. It is functionally and environmentally compatible, though it requires a physical board redesign.

  • Maintains MIL-STD-883 military grade qualification and reliability screening
  • Identical silicon electrical performance and protective features
  • Shares the full -55°C to +150°C operating temperature range
  • Lower power dissipation capability due to the smaller package volume.
  • Requires PCB layout modification to accommodate the TO-5 footprint.
Lifecycle StatusActiveActiveUnknown
Market AvailabilityIn stockNon-stockNon-stock
REACHREACHUnknownUnknown
RoHSRoHSUnknownUnknown
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