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Alternatives to Nexperia 74LVC3G34GM,125

Nexperia 74LVC3G34GM,125 and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for Nexperia 74LVC3G34GM,125

74LVC3G34GM,125 compared against its qualified second sources
74LVC3G34GM,125Nexperia74LVC3G34GT,115Nexperia USA Inc.NC7NZ34L8Xonsemi+1more
FFF CompatibilitySOT833-1 (XSON8) uses a different footprint layout compared to the obsolete SOT902-2 (XQFN8), requiring a minor PCB layout modification. Pin assignments are identical.Both are ultra-small leadless packages, but the physical dimensions differ (1.95 mm x 1.0 mm vs. 1.6 mm x 1.6 mm).Matches all original electrical performance and safety-critical ratings, including VCC supply range, drive strength, and temperature range (-40°C to +125°C).MicroPak8 (8-UFQFN) package utilizes a different pad layout and pitch, requiring an adjustment of the board's land pattern despite identical logic pin allocations.Identical physical dimensions of 1.6 mm x 1.6 mm, but uses MicroPak leadless contact geometry.The operating temperature range is limited to -40°C to +85°C, which is narrower than the original -40°C to +125°C range.
AI Summary

74LVC3G34GM,125 by Nexperia: Buffer, Non-Inverting 3 Element 1 Bit per Element Push-Pull Output 8-XQFN (1.6x1.6).

This is the manufacturer-recommended replacement of the same functional family, utilizing an ultra-small XSON8 leadless package. It serves as an excellent replacement with identical electrical specifications but requires a slight layout update to accommodate the footprint change.

  • Active lifecycle status offering long-term supply security
  • Identical electrical characteristics and operating voltage range (1.65V to 5.5V)
  • Supports partial power-down mode (IOFF) and overvoltage-tolerant inputs
  • Requires minor PCB copper/stencil pad redesign due to different layout format (XSON8 vs XQFN8)

This is an ultra-compact leadless alternative from onsemi in the MicroPak8 package. It maintains the small 1.6 x 1.6 mm size profile of the original but has a slightly different contact layout and is restricted to a narrower industrial temperature range.

  • Maintains a highly compact, 1.6 mm x 1.6 mm leadless form factor equivalent in size to the original
  • Matches logic function and wide 1.65V to 5.5V operating voltage range
  • Narrower operating temperature range (-40°C to +85°C vs original's -40°C to +125°C)
  • Slight pad layout differences require redesigning the copper pads
Lifecycle StatusObsoleteActiveActive
Market AvailabilityIn stockIn stockIn stock
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