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Alternatives to NXP USA Inc. MRF101BN

NXP USA Inc. MRF101BN and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for NXP USA Inc. MRF101BN

MRF101BN compared against its qualified second sources
MRF101BNNXP USA Inc.MRF101ANNXP USA Inc.BLP15H9S100ZAmpleon USA Inc.+2more
FFF CompatibilityPins 1 and 3 are mirrored. Pin 1 is Gate and Pin 3 is Drain on the MRF101AN, whereas Pin 1 is Drain and Pin 3 is Gate on the MRF101BN.Housed in the identical TO-220-3 plastic package with identical physical dimensions and mounting style.Identical electrical performance and characteristics, covering 1.8 to 250 MHz with 100 W CW output power.This is a surface-mount (SMD) device in a TO-270 package, whereas the original is a through-hole (THT) TO-220.Complete change in mounting style from THT to SMD.Meets the 100 W and 50 V requirements while expanding frequency support up to 2 GHz.
AI Summary

MRF101BN by NXP USA Inc.: RF Mosfet 50 V 100 mA 1.8MHz ~ 250MHz 21.1dB 115W TO-220-3.

The MRF101AN is the direct mirror-pinout sibling of the MRF101BN. It offers identical electrical specifications and thermal performance, but requires swapping pins 1 and 3 via PCB redesign or careful lead bending.

  • Direct sibling part with identical electrical specifications
  • Allows easy construction of push-pull amplifiers when paired with MRF101BN
  • Same 100W CW power rating and 50V operating voltage
  • Gate and Drain pins are physically swapped, requiring board layout modification.

The BLP15H9S100Z is an extremely rugged 100 W, 50 V RF LDMOS from Ampleon. It offers an excellent electrical match with wider frequency coverage but requires a transition to a surface-mount package.

  • Same 100 W power rating and 50 V operating voltage
  • Extremely wide frequency range from HF up to 2 GHz
  • Higher maximum junction temperature (225 °C vs 175 °C)
  • Transitioning from through-hole to surface-mount (SMD) requires completely different thermal dissipation design (planar heatsink).
  • Requires board redesign for the TO-270-2F-1 footprint.
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