All Alternatives

Alternatives to NXP MPC555LFMZP40

NXP MPC555LFMZP40 and its qualified second sources, compared on form/fit/function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

MPC555LFMZP40 compared against its qualified second sources
MPC555LFMZP40NXPMPC555LFMVR40NXP SemiconductorsMPC555LFCVR40NXP Semiconductors+1more
FFF CompatibilityFeatures the identical 272-pin PBGA package footprint (27x27 mm with 1.27mm pitch) and pinout definitions.The physical dimensions and package construction are identical, transitioning only the ball alloy to lead-free.Operates at the same 40MHz clock speed, shares the 448KB flash / 26KB SRAM memory profile, and supports identical electrical parameters.Utilizes the same 272-pin PBGA footprint and pin mappings.The physical package structure is identical to the original part.While electrically and instruction-set compatible, it is rated for a narrower industrial temperature range (-40°C to +85°C) instead of automotive grade (-40°C to +125°C).
AI Summary

MPC555LFMZP40 by NXP: * Microcontroller IC.

This is the direct lead-free (RoHS compliant) equivalent of the leaded MPC555LFMZP40. It is a true pin-for-pin drop-in replacement with identical electrical and timing characteristics. However, please note that it belongs to the same discontinued MPC555 family and shares its obsolete lifecycle status.

  • Leaded-to-lead-free upgrade (RoHS compliant) with identical silicon revision.
  • 100% true drop-in physical, electrical, and pinout replacement.
  • Matches the exact same automotive temperature range (-40°C to +125°C).
  • Shares the same obsolete lifecycle status (discontinued under NXP PCN 202402009DN).

This sibling variant offers identical pinout and architectural compatibility in a lead-free package, but is graded for a narrower industrial temperature range. It is suitable for applications that do not experience the extreme heat of automotive environments, but it is also obsolete.

  • Directly pin-compatible and footprint-compatible with the original part.
  • Eliminates lead (Pb) content as it uses RoHS-compliant ball finish.
  • Identical internal peripherals, including dual TPUs and TouCAN modules.
  • Lower maximum operating temperature (85°C vs 125°C).
  • Shares the same obsolete lifecycle status as the entire MPC555 series.
Lifecycle StatusObsoleteObsoleteObsolete
Market AvailabilityIn stockIn stockIn stock
REACHREACHREACHREACH
RoHSRoHSRoHSRoHS
Description* Microcontroller IC* Microcontroller IC* Microcontroller IC
ManufacturerNXPNXP SemiconductorsNXP Semiconductors
TypeEmbeddedEmbeddedEmbedded
DatasheetOpenOpenOpen
Lead Time50 weeksUnknown50 weeks
Country of OriginCN, MY--
Export Control Class Number3A991A23A991A23A991A2
HTSUS Code8542.31.0025--
Moisture Sensitivity Level---

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Frequently asked questions

Yes. The NXP MPC555LFMZP40 is marked obsolete, so the manufacturer has discontinued it and any remaining supply is limited to distributor stock. The qualified second sources on this page are active parts you can design in today.

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