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Alternatives to NXP USA Inc. RFEP24-300

NXP USA Inc. RFEP24-300 and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for NXP USA Inc. RFEP24-300

RFEP24-300 compared against its qualified second sources
RFEP24-300NXP USA Inc.BPC2425M9X250ZAmpleon USA Inc.MRF24300NR3NXP USA Inc.
FFF CompatibilityDifferent physical size and pinout interface.Both are open-pallet LDMOS modules, but this variant has a smaller footprint.As a single-stage pallet, it has lower gain (18 dB vs the original multi-stage ~31-33 dB) and requires a higher power drive signal.This is a discrete SMD LDMOS transistor (SOT1823) and not a fully assembled pallet module.Discrete component packaging rather than a subsystem board layout.Delivers the exact same 300W CW output power at 2.45 GHz when populated in a matching circuit layout.
AI Summary

RFEP24-300 by NXP USA Inc.: Test Equipment RF Signal Generator.

A compact 250W single-stage pallet amplifier operating at 2.4 to 2.5 GHz. It serves as an excellent alternative if the system pre-driver and driver stages can be adjusted to compensate for its lower gain.

  • Extremely compact footprint (52 mm x 34 mm)
  • High drain efficiency (61%) reduces cooling demands
  • 50 Ohm matched input and output, integrated temperature sensing and bias compensation
  • Significantly lower gain (18 dB) compared to the original multi-stage pallet, requiring a stronger input drive signal.
  • Slightly lower peak output power (250W vs 300W).

The MRF24300NR3 is the primary final-stage LDMOS power transistor around which the RFEP24-300 pallet was designed. If repairing or building a custom board to replace the obsolete pallet, this discrete component is the direct path.

  • The exact same active LDMOS transistor used in the final stage of the original pallet reference design
  • Ensures 100% equivalent RF performance, power handling (300W), and frequency capability (2.4-2.5 GHz) at the component level
  • Allows board-level repair or custom reconstruction of the original pallet circuit
  • Requires design and fabrication of the surrounding RF matching networks, biasing, and driving circuitry.
  • Not a drop-in module; component-level engineering and assembly are mandatory.
Lifecycle StatusObsoleteObsoleteObsolete
Market AvailabilityDiscontinuedDiscontinuedDiscontinued
REACHREACHREACHREACH
RoHSRoHSUnknownRoHS
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