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Alternatives to onsemi NC7SZ157L6X

onsemi NC7SZ157L6X and its qualified second sources, compared on form, fit and function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

Equivalent and substitute parts for onsemi NC7SZ157L6X

NC7SZ157L6X compared against its qualified second sources
NC7SZ157L6Xonsemi74LVC1G157GM,115Nexperia USA Inc.NC7SZ157FHXonsemi
FFF CompatibilityThe XSON6 (SOT886) package pinout and land pattern match the MicroPak 6-lead package pinout exactly (Pin 1: I1, Pin 2: GND, Pin 3: I0, Pin 4: Output, Pin 5: VCC, Pin 6: S).SOT886 has identical outer dimensions (1.45 mm x 1.00 mm x 0.50 mm) and pitch (0.50 mm) as the MicroPak package.Both are single 2-to-1 high-speed digital logic multiplexers operating from 1.65 V to 5.5 V with fully compatible logic families.The MicroPak2 footprint is smaller and utilizes a 0.35 mm pitch instead of the 0.50 mm pitch of the MicroPak package, requiring layout adjustments.Both packages are leadless and ultra-small, but MicroPak2 is smaller at 1.00 mm x 1.00 mm with a different lead pitch.This part shares the exact same silicon die as the target component, guaranteeing identical electrical and speed parameters.
AI Summary

NC7SZ157L6X by onsemi: Multiplexer 1 x 2:1 6-MicroPak.

An excellent direct drop-in replacement with identical pin assignments and package dimensions from a highly reliable second-source manufacturer. It operates over the same 1.65 V to 5.5 V range, although output drive current is slightly lower.

  • Pin-compatible drop-in alternative
  • Same wide supply voltage range: 1.65 V to 5.5 V
  • Identical package outline: 1.45 x 1.00 mm XSON6 / SOT886
  • Slightly lower maximum output drive current: 24 mA vs 32 mA

A same-series sibling from onsemi housed in the ultra-compact MicroPak2 package. It delivers the same electrical performance but is not pin-compatible because of a smaller footprint and tighter 0.35 mm pin pitch.

  • Identical electrical performance and silicon die
  • Even smaller footprint for space-constrained designs
  • Requires PCB layout modifications for the smaller 1.00 x 1.00 mm footprint and tighter pitch
Lifecycle StatusActiveActiveActive
Market AvailabilityIn stockNon-stockIn stock
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