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Alternatives to onsemi NC7SZ157L6X

onsemi NC7SZ157L6X and its qualified second sources, compared on form/fit/function, stock, lifecycle and price — the same checks Parter runs inside a BOM.

NC7SZ157L6X compared against its qualified second sources
NC7SZ157L6Xonsemi74LVC1G157GM,115Nexperia USA Inc.NC7SZ157FHXonsemi+3more
FFF CompatibilityThe pinout assignment (Pin 1: I1, Pin 2: GND, Pin 3: I0, Pin 4: Output, Pin 5: VCC, Pin 6: S) and landing pattern match the target part exactly.The Nexperia SOT886 (XSON6) package is physically identical and interchangeable with the onsemi 6-MicroPak (L6X) package.This is a functionally identical single 2-input digital multiplexer with matching logic thresholds and supply specifications.The MicroPak2 (FHX) package uses a smaller 1.00 mm x 1.00 mm footprint with a tighter 0.35 mm pad pitch, which is incompatible with the 1.45 mm x 1.00 mm MicroPak layout.Both are ultra-small SMD leadless packages, but the physical size of MicroPak2 is smaller.The internal silicon is from the same onsemi series and provides identical electrical characteristics.
AI Summary

NC7SZ157L6X by onsemi: Multiplexer 1 x 2:1 6-MicroPak.

The Nexperia 74LVC1G157GM,115 is a direct drop-in second-source replacement. It shares the identical physical footprint, pad layout, and logic functionality, while offering an upgraded maximum operating temperature of +125°C.

  • Pin-compatible drop-in replacement with identical pinout assignment
  • Exactly identical physical package dimensions (1.45 mm x 1.00 mm, 0.50 mm pitch)
  • Identical supply voltage range (1.65 V to 5.5 V) and 32 mA drive capability

This is a sibling part from the same onsemi series utilizing the smaller MicroPak2 package format. While it offers identical electrical specs and pin routing, it requires a PCB layout modification to accommodate the smaller footprint and 0.35 mm pitch.

  • Same active product family from onsemi with identical electrical specifications
  • Identical pin assignments and logic function
  • Active lifecycle status
  • Requires a PCB redesign to accommodate the smaller footprint and 0.35 mm pad pitch
Lifecycle StatusActiveActiveUnknown
Market AvailabilityIn stockIn stockUnknown
REACHREACHREACHUnknown
RoHSRoHSRoHSUnknown
DescriptionMultiplexer 1 x 2:1 6-MicroPakThe Nexperia 74LVC1G157GM,115 is a direct drop-in second-source replacement. It shares the identical physical footprint, pad layout, and logThis is a sibling part from the same onsemi series utilizing the smaller MicroPak2 package format. While it offers identical electrical spec
ManufactureronsemiNexperia USA Inc.onsemi
TypeLogicLogicComponent
DatasheetOpenOpenN/A
Lead Time14 weeks10 weeksUnknown
Country of OriginUS, TH, TW--
Export Control Class NumberEAR99EAR99EAR99
HTSUS Code8542.39.0070--
Moisture Sensitivity Level1 (Unlimited)--
TypeMultiplexer--
Circuit1 x 2:1--
Mounting TypeSurface Mount--
Package / Case6-UFDFN--
Voltage - Supply1.65V ~ 5.5V--
Independent Circuits1--
Operating Temperature-40°C ~ 85°C--
Voltage Supply SourceSingle Supply--

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Frequently asked questions

Yes. The onsemi NC7SZ157L6X is active and in production. The parts listed here are qualified equivalents if you need a second source or better availability.

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